SemiMedia

01/10/2025

October 1, 2025 /SemiMedia/ — Littelfuse Inc has launched the IX3407B, a single-channel isolated gate driver designed for high-voltage power applications, including Si/SiC MOSFETs and IGBTs. The device delivers up to 7 A peak source and sink current and incorporates 2.5 kV capacitive isolation to ensure signal integrity and system safety. The IX3407B features fast propagation delay, high common mode transient immunity (CMTI), and enhanced thermal stability, supporting efficient operation across wide switching frequencies and temperature ranges....

October 1, 2025 /SemiMedia/ — Littelfuse Inc has launched the IX3407B, a single-channel isolated gate driver designed for high-voltage power applications, including Si/SiC MOSFETs and IGBTs. The de…

01/10/2025

October 1, 2025 /SemiMedia/ — STMicroelectronics said it is leading the EU-funded STARLight consortium, a program designed to establish Europe’s leadership in 300mm silicon photonics. The initiative brings together 24 companies and research institutions from 11 countries to create a unified platform for large-scale silicon photonics manufacturing. The STARLight project focuses on developing high-bandwidth, energy-efficient photonic integrated circuits with integrated lasers and modulators, targeting next-generation datacenters, AI clusters, telecommunications and automotive systems....

October 1, 2025 /SemiMedia/ — STMicroelectronics said it is leading the EU-funded STARLight consortium, a program designed to establish Europe’s leadership in 300mm silicon photonics. The initiativ…

01/10/2025

October 1, 2025 /SemiMedia/ — onsemi said it has agreed to acquire Vcore power technologies and related intellectual property licenses from Aura Semiconductor, in a move to strengthen its position in AI data center power management. The company said the deal will expand its portfolio to address the full power chain in AI data centers, from grid to core. Sudhir Gopalswamy, group president of Intelligent Sensing and Analog and Mixed-Signal at onsemi, said the integration will enable products with higher power density, better efficiency and improved thermal performance, supporting more compute capacity per rack....

October 1, 2025 /SemiMedia/ — onsemi said it has agreed to acquire Vcore power technologies and related intellectual property licenses from Aura Semiconductor, in a move to strengthen its position …

30/09/2025

September 30, 2025 /SemiMedia/ — ROHM and Infineon Technologies AG have signed a memorandum of understanding to broaden their cooperation in silicon carbide (SiC) power semiconductor packaging. The partnership will allow both companies to act as second sources for selected SiC packages, giving customers more flexibility in design and procurement. Under the agreement, ROHM will adopt Infineon’s top-side cooling platform, covering TOLT, D-DPAK, Q-DPAK and H-DPAK packages....

September 30, 2025 /SemiMedia/ — ROHM and Infineon Technologies AG have signed a memorandum of understanding to broaden their cooperation in silicon carbide (SiC) power semiconductor packaging. The…

30/09/2025

September 30, 2025 /SemiMedia/ — Vishay Intertechnology has expanded its seventh-generation platform of 1200 V FRED Pt® Hyperfast rectifiers with four new devices in the eSMP® SlimSMA HV (DO-221AC) package. The new 1 A and 2 A rectifiers are optimized for industrial and automotive systems, offering a balance of low reverse recovery charge and forward voltage drop while achieving minimal junction capacitance and recovery time....

September 30, 2025 /SemiMedia/ — Vishay Intertechnology has expanded its seventh-generation platform of 1200 V FRED Pt® Hyperfast rectifiers with four new devices in the eSMP® SlimSMA HV (DO-221AC)…

29/09/2025

September 29, 2025 /SemiMedia/ — GlobalFoundries said it has signed a final agreement with Chinese foundry Zensemi to strengthen its “China for China” strategy, aiming to provide local chip supply for customers in the country. The partnership will focus on 40nm CMOS technology for automotive electronics, with GlobalFoundries providing the process know-how while Zensemi handles local wafer production. The move is intended to meet demand for locally manufactured chips and ensure stable delivery within China....

September 29, 2025 /SemiMedia/ — GlobalFoundries said it has signed a final agreement with Chinese foundry Zensemi to strengthen its “China for China” strategy, aiming to provide local chip supply …

29/09/2025

September 29, 2025 /SemiMedia/ — Russia’s Institute of Microstructure Physics under the Academy of Sciences has unveiled a roadmap for extreme ultraviolet (EUV) lithography equipment, targeting chip production from 40nm down to below 10nm by 2037. The project will use a non-standard wavelength of 11.2nm and is set to begin in 2026. Unlike ASML’s architecture, the Russian design proposes hybrid solid-state lasers, xenon plasma light sources, and Ru/Be mirrors to reflect 11.2nm light....

September 29, 2025 /SemiMedia/ — Russia’s Institute of Microstructure Physics under the Academy of Sciences has unveiled a roadmap for extreme ultraviolet (EUV) lithography equipment, targeting chi…

26/09/2025

September 26, 2025 /SemiMedia/ — Asia holds more than 75% of the world’s semiconductor manufacturing capacity and is expected to maintain its dominance in the next five years, Moody’s Corporation said on Thursday. The region’s leadership spans logic, memory and discrete/analog/other chips, driven by cost efficiency, a strong ecosystem and advanced expertise. According to Moody’s, Taiwan and South Korea dominate advanced nodes, producing most chips below 5nm, while Japan leads in photoresists and silicon wafers....

September 26, 2025 /SemiMedia/ — Asia holds more than 75% of the world’s semiconductor manufacturing capacity and is expected to maintain its dominance in the next five years, Moody’s Corporation s…

26/09/2025

September 26, 2025 /SemiMedia/ — Renesas Electronics on Thursday introduced its RA8T2 microcontroller group, designed to deliver high-speed and precise motor control for industrial equipment, robotics and advanced automation systems. The RA8T2 devices are powered by a 1 GHz Arm Cortex-M85 core, with an optional Cortex-M33 coprocessor, enabling both real-time motor control and additional functions such as communications on a single chip....

September 26, 2025 /SemiMedia/ — Renesas Electronics on Thursday introduced its RA8T2 microcontroller group, designed to deliver high-speed and precise motor control for industrial equipment, robot…

26/09/2025

September 26, 2025 /SemiMedia/ — Samsung Electronics is projected to secure more than 30% of the high-bandwidth memory (HBM) market next year, according to data from Counterpoint Research released on Wednesday. In the second quarter, SK Hynix led the segment with a 62% share, followed by Micron Technology with 21% and Samsung with 17%. Analysts said Samsung’s position is expected to strengthen as its HBM3E gains key customer certifications and HBM4 enters Nvidia’s supply chain....

September 26, 2025 /SemiMedia/ — Samsung Electronics is projected to secure more than 30% of the high-bandwidth memory (HBM) market next year, according to data from Counterpoint Research released …

25/09/2025

September 25, 2025 /SemiMedia/ — Micron Technology said it will start mass production of its sixth-generation high bandwidth memory (HBM4) in the first half of fiscal 2026, with customer supply agreements expected to be finalized within months. The company has already delivered HBM4 samples supporting up to 11Gbps bandwidth, addressing concerns that its next-generation memory development was lagging rivals. Nvidia has asked suppliers to provide HBM4 with 10–11Gbps speeds, above the JEDEC standard of 8Gbps....