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Benchmark Thailand is leveraging engineering depth, manufacturing complexity, and talent to strengthen its Southeast Asi...
26/08/2026

Benchmark Thailand is leveraging engineering depth, manufacturing complexity, and talent to strengthen its Southeast Asian manufacturing position.

Ken Hendrickson, Aldo C. — Benchmark Electronics

Thailand Board of Investment (BOI)

#

Benchmark Thailand is leveraging engineering depth, manufacturing complexity, and talent to strengthen its Southeast Asian manufacturing position.

26/08/2026

Technical discussions of EV on-board chargers usually focus on the high-power conversion stage: SiC versus GaN, bidirectional topologies, power density, and high-voltage battery architectures. Those topics deserve attention, but they are not the only source of development risk.

Raphi Zadicario — Lumissil Microsystems

IEC (International Electrotechnical Commission)

ISO - International Organization for Standardization



26/08/2026

The platform enables enterprise SSDs to serve as a persistent memory layer supporting KV cache offload and autonomous AI agents.

Jason Chien — Senior Director of Enterprise Product Marketing at Silicon Motion



Altera has expanded DDR5 memory support across its Agilex FPGA portfolio with the release of Quartus Prime Pro Edition S...
26/08/2026

Altera has expanded DDR5 memory support across its Agilex FPGA portfolio with the release of Quartus Prime Pro Edition Software version 26.1.1



Altera has expanded DDR5 memory support across its Agilex FPGA portfolio with the release of Quartus Prime Pro Edition Software version 26.1.1

As automotive compute demands accelerate, chiplet architectures offer scalable performance without sacrificing cost, sof...
26/08/2026

As automotive compute demands accelerate, chiplet architectures offer scalable performance without sacrificing cost, software reuse, or reliability.

Cyril Cordoba — Senior Director of System Architecture for Renesas Electronics' HPC SoC Business Division



As automotive compute demands accelerate, chiplet architectures offer scalable performance without sacrificing cost, software reuse, or reliability.

Semtech is selling its cellular module business to Taiwan-based Compal Electronics for $62 million.Hong Hou — President ...
26/08/2026

Semtech is selling its cellular module business to Taiwan-based Compal Electronics for $62 million.

Hong Hou — President and Chief Executive Officer, semtech Corp.



Semtech is selling its cellular module business to Taiwan-based Compal Electronics for $62 million.

The industry is seeing rapid pe*******on of OLED technology in the gaming and premium display markets.TrendForce Corp., ...
26/08/2026

The industry is seeing rapid pe*******on of OLED technology in the gaming and premium display markets.

TrendForce Corp., TrendForce 集邦科技

ASUS, Samsung Electronics, LG Electronics



The industry is seeing rapid pe*******on of OLED technology in the gaming and premium display markets.

As AI models and contexts grow, unified memory helps edge systems sustain workloads beyond discrete memory limits.Christ...
26/08/2026

As AI models and contexts grow, unified memory helps edge systems sustain workloads beyond discrete memory limits.

Christopher Moore — VP of Marketing for the Mobile and Client Business Unit at Micron Technology



As AI models and contexts grow, unified memory helps edge systems sustain workloads beyond discrete memory limits.

The Summit will expand to a full-day program spanning cloud and accelerated computing, memory, interconnects, power mana...
26/08/2026

The Summit will expand to a full-day program spanning cloud and accelerated computing, memory, interconnects, power management and system co-design.

SEMICON Taiwan 2026, CEO Summit, Ecosystem Executive Summit

Speakers:

Amin Vahdat — Senior Vice President and Chief Technologist for AI and Infrastructure, Google

Jon Kemp — CEO, Qnity Electronics

Ahmad Khan — President, Semiconductor Products and Customers, KLA

Benjamin Hein — Member of the Executive Board and CEO Electronics, Merck KGaA, Darmstadt, Germany

Rani Borkar — President, Azure Hardware Systems and Infrastructure, Microsoft

Manish Bhatia — Executive Vice President, Global Operations, Micron Technology

Asad Khamisy — Senior Vice President and General Manager, Broadcom

Alexander Gorski — Chief Operations Officer, Infineon Technologies

CQ (Chunqiang) Tang, PhD — Vice President, AI and Compute Foundation, Meta

Michael Kagan — Chief Technology Officer, NVIDIA

Tien Wu — CEO of ASE Global and Chair of the SEMI Global Board

Cliff Hou — Chairman of the Taiwan Semiconductor Industry Association (TSIA)

Rick Tsai — Vice Chairman and CEO of MediaTek

Young Liu — Chairman of TEEMA and Chairman of Hon Hai Technology Group (Foxconn)

Shan-Chieh Chien — Chairman and CSO of Unimicron



The Summit will expand to a full-day program spanning cloud and accelerated computing, memory, interconnects, power management and system co-design.

Lam Research is expanding its   engineering workforce to support advanced packaging, HBM and silicon photonics technolog...
26/08/2026

Lam Research is expanding its engineering workforce to support advanced packaging, HBM and silicon photonics technologies.

Andrew Goh — Corporate Vice President and General Manager for Southeast Asia, Lam Research (India) Private Ltd

Ang Wee Seng — Executive Director, Singapore Semiconductor Industry Association (SSIA)

Singapore Economic Development Board (EDB)

Nanyang Technological University Singapore, National University of Singapore, Singapore Institute of Technology



Lam Research is expanding its Singapore engineering workforce to support advanced packaging, HBM and silicon photonics technologies.

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