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04/02/2022

Industry 4.0 spurs globalization
Hands holding a tablet in front of an industrial robot.
The growth of digitization has had a great impact on the global business landscape. Sandvik talked to Industry 4.0 expert Philipp Ramin to find out what’s in store for the future.

Industry 4.0, or the fourth industrial revolution, is not, as many perceive, an initiative to secure the survival of Western manufacturing units in the face of low-wage competition from China and developing countries. It is, instead, a move towards next-generation production methods that will lead to further globalization, especially for small and medium-sized companies.

So says Philipp Ramin, co-founder and CEO of the consulting and training company Innovationszentrum für Industrie 4.0, based in Regensburg, Germany. “In all honesty, it may have started to improve competitiveness, but Industry 4.0 will actually strengthen ties between companies all over the world,” he says. “That’s a consequence of the concept.”

04/02/2022

The Opel Astra fully digital cockpit, powered by Snapdragon Automotive Cockpit Platforms
Qualcomm Technologies, Inc. and Opel Automobile GmbH (Opel) today announced that the upcoming Opel Astra – Opel’s latest addition to its compact class of electrified vehicles – will utilize next-generation Snapdragon® Automotive Cockpit Platforms. These platforms will power the Astra’s fully digital Pure Panel digital cockpit, which features extra-wide high-definition touchscreen displays, with new human-machine-interface (HMI), that are designed to provide a simple, seamless and intuitive in-cabin experience for the vehicle’s occupants. Designed to provide premium experiences, the Snapdragon Automotive Cockpit Platforms will also support the vehicle’s precise positioning navigation as well as voice command capabilities, wireless mirroring, and premium audio and sound.

02/02/2022

A new untethered and insect-sized aerial vehicle
Researchers at Toyota Central R&D Labs have recently created an insect-scale aerial robot with flapping wings, powered using wireless radiofrequency technology. This robot, presented in a paper published in Nature Electronics, is based on a radiofrequency power receiver with a remarkable power-to-weight density of 4,900 W kg-1.
"Small drones typically have a very limited operating time due to their power source," Takashi Ozaki, one of the researchers who carried out the study, told TechXplore. "The purpose of our recent research was to overcome this limitation. Currently, no-contact power supply using electromagnetic waves has been put to practical use in various products, but it was unknown how far it could be applied to small flying robots."
The main objective of the recent study by Ozaki and his colleagues was to power an insect-size flying robot using no-contact, wireless charging technology. The robot created by the researchers is essentially comprised of a flapping, piezoelectric actuator that is powered through a 5 GHz dipole antenna.

02/02/2022

IBM and Samsung team up to design vertical transport field effect transistors
Officials from IBM and Samsung announced at this year's IEDM conference in San Francisco a collaboration on a new chip design that adds transistors vertically on a chip. As part of their announcement, they suggested that their vertical transport field effect transistors (VTFET) could double the speed of processor chips, or alternatively, reduce the power they use by up to 85 percent.
Since the beginning of digital technology, processing chips have been made by placing tiny transistors on a chip and connecting them. Over time, engineers have placed increasingly more transistors on chips that have remained roughly the same size—adhering, generally, to Moore's Law, which states that the number of transistors on a chip should double every year. Engineers have known for a long time that there are limits to Moore's Law—eventually, it would become impossible to add even one more transistor, much less double the number that are there.
So researchers are looking for other ways to make chips. But in the meantime, engineers continue to look for ways to add more transistors to conventional chips. In their announcement, IBM and Samsung have explained that they are taking steps to begin designing chips that can expand vertically. In a practical sense, the move was inevitable. As an analogy, when towns grew too big to be efficient, engineers began making buildings taller, essentially turning 2D towns into 3D cities. Officials and engineers at IBM and Samsung (and doubtless other corporations, such as Intel) suggest that now is the time to begin doing the same with microprocessors.

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