Circuits Assembly Magazine

Circuits Assembly Magazine Circuits Assembly has more than 30 years as the clear-cut leading brand and technical publication for electronics manufacturers worldwide.

Our January edition of PCD&F/CIRCUITS ASSEMBLY is now available at https://digital.pcea.net/Check out this month's cover...
01/08/2026

Our January edition of PCD&F/CIRCUITS ASSEMBLY is now available at https://digital.pcea.net/

Check out this month's coverage on , , , , , , , streamlining feedback, and MORE.

Brought to you by . FREE individual membership: https://pcea.net/membership/ Gain access to our and other benefits!

How do modern and influence and volume repeatability as features continue to shrink?A new study from , and , ...
01/08/2026

How do modern and influence and volume repeatability as features continue to shrink?

A new study from , and , investigates 0.5mm on five with different coatings, plus an uncoated stencil as a baseline. Teaser: All coatings outperformed the uncoated stencil.

12/23/2025

ince 2018, Reliability Matters has been building a knowledge vault, capturing the wisdom of industry experts for engineers everywhere. In this special year-end episode, we celebrate the journey, the growth, and the community that made it possible.

12/23/2025

Mike Konrad continues a dive into the world of contract manufacturing—a vital piece of the electronics ecosystem.Joining him are two industry leaders who know this space inside and out. First, we have Daniel Stanphill, SMT process engineer at Aurora Boardworks, and alongside him, Sean Kincaid, pre...

PCEA wishes you a safe and happy holiday! We're looking forward to 2026!
12/19/2025

PCEA wishes you a safe and happy holiday! We're looking forward to 2026!

Check out John Burkhert's feature in the December digital on "Interconnect Technology for Chiplets: UCIe 3.0 is where ba...
12/18/2025

Check out John Burkhert's feature in the December digital on "Interconnect Technology for Chiplets: UCIe 3.0 is where bandwidth meets bravado." https://digital.pcea.net/issues/december-2025/designers-notebook/

"In August, the Universal Chiplet Interconnect Express standard revision 3 was issued. This follows revision 2 by exactly a year. The first selling point of revision 3 is higher data rates, double that of the previous version. If that sounds like another standard, PCIe, then chalk it up to UCIe using PCIe as a template, along with the Compute Express Link (CXL), to build the UCIe ecosystem. It remains adaptable and scalable according to needs."

Check out Hemant Shah's feature in the December digital on "From One-Way Handoffs to True Bidirectional Design Data Exch...
12/17/2025

Check out Hemant Shah's feature in the December digital on "From One-Way Handoffs to True Bidirectional Design Data Exchange Using IPC-2581: A simpler, smarter way to get stackups right the first time." https://digital.pcea.net/issues/december-2025/data-transfer/

"For years, we talked about “handing off” design data to manufacturing partners. Many still do. The handoff model is simple: design sends “build intent” in one direction, usually through a mix of emails, spreadsheets, PowerPoints and Word documents.

Almost every handoff – 99.99% – contains conflicting or incomplete data. This forces the fabricator to come back with questions, clarifications and technical queries. There’s no true back-and-forth, no structured loop and no clean way to exchange data that is consumable by the or CAM tools.

This month, we will focus on a key piece of the puzzle: data exchange. Next month, we’ll dive into electronic and technical queries (TQs)."

Save the date for PCB East April 28 - May 1 (one-day exhibition on Wednesday, April 29) at the DCU Convention Center in ...
12/16/2025

Save the date for PCB East April 28 - May 1 (one-day exhibition on Wednesday, April 29) at the DCU Convention Center in , MA! Visit pcbeast.com for more information.

Connect with leading suppliers and explore cutting-edge technology in , , and . Experience the future of at the one-day exhibition

Continue your learning journey with the 4-day conference (April 29 - May 2), featuring leading industry experts.

The Industry's Conference and Exhibition.

Brought to you by PCEA .

Check out Ed Dodd's feature in the December digital on "The Victory Plan Reborn: How the DoW is Mobilizing the Industr...
12/15/2025

Check out Ed Dodd's feature in the December digital on "The Victory Plan Reborn: How the DoW is Mobilizing the Industrial Base: Innovation gets applause, manufacturing gets contracts." https://digital.pcea.net/issues/december-2025/dodd/

"We’re almost out of time. That is the message underlying US Department of War Secretary Peter Hegseth’s 'Arsenal of Freedom' speech on acquisition reform last month. We’ve spent a long time chasing 'perfect,' with successful programs creating low volumes of some of the most exquisite military systems in the world. These military systems have allowed us to dominate non-peer adversaries with little attrition. Recently, the war in Ukraine and threats in the Indo-Pacific have resurrected the threat of near-peer conflict. They have shown us what to expect from modern battlefields and have exposed a fundamental flaw in the DoW’s acquisition approach: slowness."

Check out Mark Finstad's feature in the December digital on "Flex Final Finishes: can use rigid board finishes, but so...
12/12/2025

Check out Mark Finstad's feature in the December digital on "Flex Final Finishes: can use rigid board finishes, but some of them crack under pressure the moment you ask them to bend." https://digital.pcea.net/issues/december-2025/the-flexperts/

"Is it possible for flex circuits to have the same final finishes available for rigid ?

Yes, you can use any of the final finishes available for , but whether you should use them depends on the application. Some standard finishes used on rigid PCBs are not suitable for flex applications. Here we go over some of the common and emerging finishes and the impact of using them on ."

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Read the latest issue of CIRCUITS ASSEMBLY now!

Materials Considerations for Automotive Radar Designs

Advanced safety systems require cars to react in response to external changes, leaving decisions to the vehicle, not the human occupants. An investigation of chemical process changes needed to improve radar module reliability, looking at radar designs, reliability requirements, and improvement options at the board and packaging levels.

by Lenora Clark, Paul Salerno and Senthil Kanagavel