http://www.thermalconference.com/

Advancements in Thermal Management Conference, Denver, CO (2026)

12/15/2021

The Advancements in Thermal Management 2022 call for paper is now open. This event provides a technical forum to discuss the latest developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements in the temperature management industry. Submit an abstract by Feb. 25th to be considered.

Submit your abstract to speak at the Advancements in Thermal Management Conference. This event provides a forum to discuss cutting edge developments in thermal technology, market conditions and end-user requirements.

08/02/2021

The 2021 Advancements in Thermal Management Conference starts Wednesday. The event will host companies from across the industry for two days, and this is your time to network and meet with them.

Participating Companies - https://www.thermalconference.com/participatin
Program - https://www.thermalconference.com/conference-schedule
Register - https://www.thermalconference.com/register

The event will feature two full days of speakers, online expo hall, personalized 1 on 1 meetings and sessions that are available up to 6 months after the event. Don't miss out. It's time to sign up!

Participating Companies at the Advancements in Thermal Management Conference

07/29/2021

Thermal 2021 starts next week. Get signed up to network with the biggest thought leaders in the thermal and electronics industry!

Advancements in Thermal Management is the foremost conference on electronics cooling. The conference is designed for design engineers, academia, system engineers, material scientists, CTOs and R&D with organizations in industries whose products depend on temperature control.

07/26/2021

The 2021 Advancements in Thermal Management Conference is next week. Join our thermal management experts, and other industry professionals at this two day virtual event.

Participating companies include: Facebook, Intel, Dell, Ford Motor Co., Fujitsu, HENKEL, Siemens, MSC | Hexagon, Honeywell, Huawei, LG, Qorvo, NASA Jet Propulsion Lab, Toshiba, Parker-Hannifin, STMicroelectronics and many more.

https://www.thermalconference.com/

The event will feature two full days of speakers, online expo hall, personalized 1 on 1 meetings and sessions that are available up to 6 months after the event. Don't miss out.

Advancements in Thermal Management is the foremost conference on electronics cooling. The conference is designed for design engineers, academia, system engineers, material scientists, CTOs and R&D with organizations in industries whose products depend on temperature control.

07/13/2021

Thermal Management Considerations for Today’s High-Performance COTS Backplane Systems
By - Justin Moll, Vice President of Sales & Marketing - Pixus Technologies

The session will go into the thermal challenges of these high-performance COTS embedded systems and potential solutions. The methods include conduction, forced air cooling, and hybrid techniques in commercial and MIL-grade rugged enclosure systems. Also included will be the perspectives of balancing I/O, serviceability, backplane interfaces, environmental requirements, and reducing SWaP (size, weight, and power).

Conference Agenda for the Advancements in Thermal Management Conference. See the event schedule of speakers.

07/08/2021

Session Spotlight - https://www.thermalconference.com/conference-schedule2

High Thermal Conductivity Thermal Interface Materials Based on an Epoxy Matrix by Kevin Roth, Project Manager, High Performance Materials -ADA Technologies, Inc.

Thermal interface materials (TIMs) more and more play an important role in thermal management of modern electronics. One such specialized application is in aerospace and satellite electronics, which require TIMs with wide temperature range, high reliability, and low outgassing. TIMs based on thermoset epoxy resins provide advantages over those based on traditional thermoplastics and silicones, and can meet the aforementioned critical application requirements. In this study, two processes have been developed to synthesize high thermally conductive TIM pads based on thermoset epoxy resin matrix. One approach is to directly disperse thermally conductive additives into an epoxy matrix to achieve random dispersion. The other is to align thermally conductive fiber into an epoxy matrix to achieve orderly dispersion. Here, we will present process steps, thermal properties, and potential device application.

Conference Agenda for the Advancements in Thermal Management Conference. See the event schedule of speakers.

07/07/2021

Thermal Conference is Coming Soon!

The 2021 Advancements in Thermal Management Conference is fast approaching. Register for this conference, being hosted virtually on Aug. 4-5.

The event will feature two full days of speakers, online expo hall, personalized 1 on 1 meetings and sessions that are available up to 6 months after the event. Don't miss out.

Advancements in Thermal Management is the foremost conference on electronics cooling. The conference is designed for design engineers, academia, system engineers, material scientists, CTOs and R&D with organizations in industries whose products depend on temperature control.

07/01/2021

UCLA engineers have demonstrated successful integration of a novel semiconductor material into high-power computer chips to reduce heat on processors and improve their performance. The advance greatly increases energy efficiency in computers and enables heat removal beyond the best thermal-management devices currently available.

The research was led by Yongjie Hu, an associate professor of mechanical and aerospace engineering at the UCLA Samueli School of Engineering.

UCLA engineers have demonstrated successful integration of a novel semiconductor material into high-power computer chips to reduce heat.

06/28/2021

Thermal Conference Session Spotlight - San Jose State University

PCM and Heat Pipes for Temperature Reduction in Electric Vehicle Batteries - Dr. Sohail Zaidi, Mechanical Engineering Department - San Jose St. University

https://www.thermalconference.com/conference-schedule2

This project utilizes phase change material (PCM) to absorb the instant high-temperature spikes that may appear in electric vehicle batteries. Due to the poor thermal conductivity of PCM, heat pipes (HP) are used to rapidly transfer the heat from the heat source into the PCM. Thus, the advantages of the HP and PCM are effectively combined to reduce the temperature spikes.

A mimic battery is designed to simulate a quarter model of the EV battery. Phase change material (PCM) was obtained from a supplier who provided the specifications of the material that indicted the phase transition temperature (PTT) (50°C). Small flat heat pipes were obtained (75 mm X 11 mm X 3 mm) that were bent before they were installed inside the PCM testing box. The test was conducted in three trials: without using any cooling medium, with PCM, and with PCM-HP. K-type thermocouples were calibrated and were used to obtain the temperature data at various locations inside the test box. Multiple ceramic tubes were used to insert and protect the thermocouple wires. An Agilent Technologies data acquisition system was used to acquire and process the temperature data. Experimental results were plotted and analyzed.

The temperature reduction obtained with the PCM-HP configuration was higher by 13°C to 3°C (or 31.21% to 7.70%) in comparison with PCM configuration. From the temperature distribution plot, it is observed that the HPs help in drawing the heat from mimic battery and spreading it through the PCM. Experimental results are compared with those available in the literature and will be discussed in the presentation.

Conference Agenda for the Advancements in Thermal Management Conference. See the event schedule of speakers.

06/23/2021

New Session Alert from MSC Software

10x Productivity in Thermal Simulation on Battery Pack Designs - Speaker: Yuya Ando, CFD and Multiphysics Business Manager in North America - Hexagon - MSC Software

https://www.thermalconference.com/conference-schedule

In recent years, electrification of various types of vehicles and aircrafts are one of the big paradigms shifts in product design and research. Currently, Lithium-Ion Batteries (LIB) are one of the most popular types while there are many other battery types which perform differently depending on the ambient temperature. While a battery tends to perform better in elevated temperature, it shortens a life cycle. On the other hand, the battery’s capacity rapidly decreases at low temperatures. Some applications require to perform in extremely cold or hot temperatures. It is also known that maintaining the uniform temperature across the cells are critical to ensure higher efficiency and longer battery life.

While thermal performance was traditionally assessed through physical prototyping and extensive tests, many of the battery pack manufactures utilize computational fluid dynamics (CFD) software to predict and to even optimize such a design in recent years. The exponential increase in computing power has been instrumental to facilitate such simulations. However, it is also true that engineers often encounter the situation where a 3D CAD model needs to be cleaned or simplified before a simulation is run, and this is where an engineer can spend a lot of time.

In this presentation, a new technology called Voxel Fit Meshing in Cradle scFLOW CFD software will be introduced. Voxel Fit Meshing simplifies the data cleaning and meshing processes and improves the productivity by 10 times or more as it can drastically reduce the manual operation and it could even help the complete automation from a CAD data to postprocessing. In turn, this technology can help in significantly reducing the product lead time while achieving an optimal design within given constraints.

Conference Agenda for the Advancements in Thermal Management Conference. See the event schedule of speakers.

06/22/2021

Semiconductor Digest has signed on to be a media supporter of the Advancements in Thermal Management 2021 conference.

https://www.thermalconference.com/2021-sponsors

Subscribe to Semiconductor Digest to get news and industry trends delivered to your inbox. They have a daily newsletter, six topical newsletters, a magazine and a website. Look them up for
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MSC Software develops simulation software technology that enables engineers to validate and optimize designs using virtual prototypes. Our CFD solutions are characterized by user-friendly interfaces, high accuracy, and high efficiency.

Advancements in Thermal Management Conference

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