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09/26/2025

RIGOL: SA6000 Series Real-Time Spectrum Analyzer: PORTLAND, OR — RIGOL Technologies has unveiled the RSA6000 Series Real-Time Spectrum Analyzer, built on the newly upgraded UltraReal platform. This innovative instrument seamlessly integrates high-performance signal capture, multi-dimensional signal analysis, and flexible portable deployment, empowering engineers to capture fleeting signals and build their ideal RF testing workstation.

Performance Leap: See Clearer, Capture Faster

The New RSA6000 Series Real-Time Spectrum Analyzer: Engineers' Ultimate Leap in Spectrum Analysis. The RSA6000 Series makes no compromises on RF performance, ensuring engineers can uncover every detail of their signals:

* Up to 200 MHz real-time analysis bandwidth with 100% POI (Probability of Intercept) as low as 3.83 μs, making transient signals like frequency hopping and pulses fully visible.

* In Real-Time Spectrum Analysis (RTSA) mode, scanning speeds up to 4 THz/s enable rapid scanning of ultra-wideband spectra, greatly enhancing efficiency in spectrum monitoring and interference detection.

* Frequency coverage from 5 kHz to 26.5 GHz, supporting diverse testing scenarios from low-frequency communications to microwave radar.

* Exceptional phase noise performance as low as -108 dBc/Hz , 10kHz offset, providing a clean benchmark for evaluating critical components like oscillators and phase-locked loops.

* DANL (Displayed Average Noise Level) as low as -163 dBm/Hz (typ.), for effortless capture of weak signals.

Analysis Leap: Five Modes, One Versatile Instrument

The RSA6000 Series deeply integrates five core measurement modes, allowing one-click switching to transform into specialized analysis tools, meeting engineers' needs across various testing phases.

* General Purpose Spectrum Analysis (GPSA): A powerful traditional swept analysis mode offering automated measurements such as channel power, adjacent channel power ratio (ACPR), occupied bandwidth (OBW), and harmonic distortion.

* Real-Time Spectrum Analysis (RTSA): Utilizes density maps, spectrograms, and PvT views to intuitively display time, frequency, and amplitude changes in complex signals—ideal for resolving inter-channel interference, spectrum monitoring, and frequency-hopping signal analysis.

* Vector Signal Analysis (VSA): Optional demodulation analysis with 200 MHz vector demodulation bandwidth, easily handling various wideband communication signals through constellation diagrams, eye diagrams, EVM, and other parameters for comprehensive transmitter quality assessment.

* Analog Demodulation (ADM): Supports in-depth analysis of AM/FM/PM analog modulated signals, automatically measuring key parameters like carrier power, modulation depth, and frequency deviation.

* EMI Pre-Compliance Analysis (EMI): Built-in CISPR-compliant filters for pre-testing conducted and radiated emissions, identifying and mitigating conducted/radiated disturbance sources to accelerate product time-to-market.

Experience Leap: Flexible Deployment, Seamless Collaboration
The RSA6000 Series breaks free from the constraints of traditional benchtop instruments, delivering unprecedented flexibility for engineers.

* Touch-Optimized UI Design: A brand-new touch UI provides a tablet-like smooth experience, making complex spectrum measurements intuitive, efficient, and effortless.

* Web Control and Remote Collaboration: Access the full instrument control interface and view real-time results via any web browser—no software installation required. Whether you're on-site or remote, enable monitoring, collaborative debugging, or educational demonstrations from anywhere.

* Rich Interfaces and Programmability: Standard HDMI, LAN, USB interfaces, plus a complete SCPI command set and driver support for quickly building automated test systems.

* With one-click mode switching, web-based remote collaboration, and a lightweight design for grab-and-go portability, the RSA6000 serves as engineers' core platform throughout R&D, validation, and troubleshooting—truly packing a high-end experience into a portable spectrum workstation.

Versatile Powerhouse: Tackling Diverse Testing Challenges

Whether in cutting-edge scientific research or demanding industrial applications, this spectrum analyzer delivers comprehensive solutions. In wireless communications and RF testing, it enables deep characterization and validation of components and systems. During electronics R&D and production, it helps engineers pinpoint noise interference sources and ensures fast compliance testing on production lines. For spectrum monitoring tasks, its superior transient signal capture ensures rogue signals have nowhere to hide. In EMI pre-compliance testing, it's an invaluable tool for quickly identifying conducted and radiated issues, speeding up product launches.

Learn more at www.rigolna.com.

August 2025

09/26/2025

Nordson Wins Technology Award for MXI Solution: MINNEAPOLIS, MN — Nordson Test & Inspection is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Inspection – AXI for its cutting-edge Quadra® 7 Pro MXI System. The award was presented during a ceremony at SMTA Guadalajara, recognizing the most innovative technologies advancing electronics manufacturing in Mexico.

Engineered for back-end semiconductor and SMT inspection, the Quadra® 7 Pro delivers breakthrough performance with Nordson’s proprietary Onyx® detector, setting a new standard in image clarity and ultra-low noise output. The system is designed to meet the evolving challenges of advanced electronics packaging, miniaturization, and complex assemblies—making it an essential tool for manufacturers focused on precision and reliability.

“Winning the Mexico Technology Award reinforces our focus on pushing the boundaries of inspection performance,” said Brian Dodier, Vice President, XRT Division, Nordson Test & Inspection. “The Quadra® 7 Pro MXI System is the result of years of innovation and collaboration with our customers to deliver sharper images, faster analysis, and greater process insight in even the most demanding production environments.”

At the heart of the system is the Dual Mode Quadra NT4® X-ray source, which allows users to switch effortlessly between high-brightness and high-resolution modes—maximizing flexibility and efficiency across applications. Paired with Revalution™ software, the platform simplifies operation and enhances decision-making through intuitive workflows, real-time analytics, and robust image processing tools.

Designed for semiconductor and SMT applications for vertical such as automotive, aerospace, and high-reliability applications, the Quadra® 7 Pro enables faster failure analysis and supports the zero-defect initiatives driving Industry 4.0.

The Mexico Technology Awards recognize the most recent technological innovations in Mexico's manufacturing landscape, spotlighting achievements by OEM manufacturing equipment and materials suppliers over the past year. For more information about the awards, please visit: www.mexicoems.com/mta-awards.
For more information, visit www.nordson.com/test-and-inspection.

August 2025

09/26/2025

Saki Wins Award for Integrated Software Solutions: TOKYO, JAPAN — Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is proud to announce that it has received the 2025 Mexico Technology Award in the category of Integrated Software Solutions for its powerful software, launched earlier this year, featuring the innovative One Programming and Easy Programming features. The award was presented during a ceremony held at SMTA Guadalajara, recognizing exceptional innovation and technological advancement in electronics manufacturing.

Saki’s integrated software solution redefines the standard for inspection software by offering a fully unified programming environment across AOI, SPI, and AXI platforms*. With One Programming, users can create a single program that seamlessly runs across all inspection systems, while Easy Programming reduces programming time and effort with automated inspection program development tools and eliminate programming errors with comprehensive automated inspection data creation.

*AXI support scheduled for 2026

“This award validates the hard work of our global R&D teams in developing truly integrated solutions that simplify operations, reduce programming time, and improve inspection quality,” said Craig Brown, General Manager of Saki America and Saki Mexico. “Saki’s innovative software solution empowers our customers to operate smarter, faster, and more consistently across their production lines.”

The Mexico Technology Awards recognize the most recent technological innovations in Mexico's manufacturing landscape, spotlighting achievements by OEM manufacturing equipment and materials suppliers over the past year. For more information about the awards, please visit: www.mexicoems.com.
For more information, visit www.sakicorp.com/en.

August 2025

09/26/2025

Inovaxe Shows Next-Gen Smart Storage and More: See Inovaxe at SMTAI, Booth 2823


BOCA RATON, FL — Inovaxe, a global leader in innovative material handling and inventory control systems, today announced plans to exhibit in Booth 2823 at SMTA International 2025, taking place October 21-23 at the Donald E. Stephens Convention Center in Rosemont, Illinois.

At the show, Inovaxe will present its latest portfolio of smart storage systems designed to maximize floor space, improve traceability, and enhance efficiency across electronics manufacturing environments. Featured solutions will include:

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SREX700 Stationary Stockroom Rack – Purpose-built for high-density 7-inch reel storage, capable of storing up to 880 seven-inch reels offering reliable organization in permanent stockroom environments.

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SREX200-9 Stationary Stockroom Rack – A versatile, high-density system that supports 7-, 13-, and 15-inch reels in just 2.5 square feet. Intelligent sensors, LED indicators, and modular scalability make it ideal for space-limited facilities.

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SR200-7 Mobile Kit Rack – Designed for mobility and flexibility, this smart rack balances density and portability, seamlessly guiding operators with Inovaxe’s intuitive LED-based retrieval and return system.

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LS350 Line-Side Rack – Providing immediate access to 192 seven-inch reels directly at the SMT line, this solution ensures just-in-time replenishment and supports rapid production changeovers.

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SRS-29-24 Stencil Rack – Featuring a newly designed cabinet door with a viewing window, this storage unit provides safe and efficient organization of stencils while enhancing visibility.

In addition to storage solutions, Inovaxe will highlight two powerful technologies that drive smarter, more connected manufacturing:

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InoBright – Transforms OEM pick-and-place feeder carts into intelligent, traceable storage systems. By delivering real-time visibility into material locations and feeder orientation, InoBright minimizes setup errors, reduces downtime, and accelerates changeovers.

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MODI V5 Incoming Goods Scanner – A compact powerful unit that automates incoming goods inspection. MODI V5 identifies supplier labels, verifies against purchase orders, and generates a unique identifier label for lifecycle traceability—integrating seamlessly with ERP and MES systems and Inovaxe’s InoAuto software.

“We have always focused on eliminating inefficiencies in materials management, and at SMTA International we’ll show how our systems go beyond storage to deliver real-time intelligence, traceability, and agility to electronics manufacturers,” said Margy Khoshnood, Executive VP at Inovaxe. “Whether on the production floor, in the stockroom, or at incoming inspection, our solutions are designed to optimize every step of the materials lifecycle.”

Visitors to Booth 2823 can explore hands-on demonstrations of Inovaxe’s systems, see how the company’s smart racks integrate seamlessly into existing workflows, and learn how its technologies are helping manufacturers worldwide reduce costs, save floor space, and achieve higher efficiency.

To learn more, visit www.inovaxe.com.

August 2025

09/26/2025

HyRel Honored with Mexico Technology Award: PEORIA, AZ ― HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to announce that it has been honored with a 2025 Mexico Technology Award in the Soldering Robots category for its groundbreaking Robotic Solder Dip & BGA Reballing Versacell System. The award was presented during a special ceremony held at the SMTA Guadalajara Expo & Tech Forum, recognizing excellence in electronics manufacturing equipment, materials, and software across the region.

HyRel’s proprietary “touchless” Micro-Robotic Nano Platform enables non-contact tin dendrite removal and precise solder alloy replacement, redefining industry benchmarks for component reliability and process consistency. This cutting-edge system not only restores solderability but does so with unmatched precision, speed, and repeatability—making it a powerful tool for high-reliability applications in defense, aerospace, and advanced electronics.

Designed to dramatically improve throughput, the Versacell System can process between 1 and 12 components, reducing cycle times from minutes on existing platforms to seconds per cycle—outpacing traditional manual and semi-automated methods while maintaining the highest quality standards. The system supports robotic hot solder tinning, BGA reballing, and lead-finish conversion with superior control, helping manufacturers meet stringent industry certifications with confidence.

In addition to technical performance, the Versacell System is engineered for usability and environmental responsibility. The compact, modular platform is intuitive to operate, integrates easily into existing workflows, and minimizes material waste through its advanced, eco-conscious processes.

With this award, HyRel Technologies affirms its leadership in robotic soldering innovation and its commitment to delivering reliable, cost-effective solutions that support next-generation manufacturing needs.

The Mexico Technology Awards, organized by Mexico EMS, recognize excellence in electronics manufacturing technologies that advance the capabilities of the region’s production ecosystem. For more information, visit: www.mexicoems.com/mta-awards.
For more information on HyRel Technologies, visit: www.hyrel.tech.

August 2025

09/26/2025

KIC to Debut HeatMap Real-Time Oven Monitoring: See KIC at SMTAI, at Booth 2931


SAN DIEGO, CA — KIC, the leader in smart thermal process technologies for electronics manufacturing, is excited to announce plans to exhibit at SMTA International 2025, taking place October 21–23 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Visit Booth 2931 to experience the latest in real-time thermal process innovation, including the debut of HeatMap™, a revolutionary enhancement to KIC’s profiler-based ecosystem, and the company’s powerful TAS (Thermal Analysis System) Software.


Introducing HeatMap™: Real-Time Oven Monitoring Reimagined

HeatMap™ transforms KIC's existing profiler tools—like the SPS Smart Profiler and X5 Profiler—into always-on, in-process monitoring systems, giving manufacturers real-time visibility into oven zone stability during every shift. Traditionally used for periodic validation during NPI or process setup, KIC profilers now operate as full-time performance monitors, bridging the gap between setup and sustained thermal control.

This breakthrough system utilizes a multi-zone HeatMap probe and advanced TAS software integration to detect even subtle thermal drifts. With live, graphical displays and automatic tolerance detection, HeatMap enables engineers and operators to identify deviations instantly, helping to prevent defects and rework before they happen. Optional light bars provide visual alerts right on the production floor for even faster response.

HeatMap offers a cost-effective way to extend profiler utilization from ~10% to over 90%, improving ROI without modifying oven hardware or workflows. It's compatible with all major reflow and curing ovens and can be self-installed or deployed with KIC support.

“HeatMap gives manufacturers the insight they’ve been missing between profile runs,” said Miles Moreau, General Manager of KIC. “It’s about moving from reactive to proactive—catching issues before they become problems.”

TAS Software: Smart Automation for Thermal Process Control

Also featured at SMTAI will be KIC’s Thermal Analysis System (TAS) software—an AI-powered platform that simplifies thermal profiling and automates recipe optimization, delivering faster setup, better traceability, and more stable production across SMT lines.

A standout feature of TAS is the award-winning Common Recipe Finder, which intelligently identifies a single oven profile that can be used across multiple assemblies. This dramatically reduces changeovers and maximizes oven utilization—ideal for today’s high-mix production environments.

Experience the Future of Thermal Management at Booth 2931

KIC invites SMTA International attendees to stop by Booth 2931 for live demonstrations of HeatMap™, TAS software, and the latest profiler solutions. Discover how KIC is enabling manufacturers to meet the rising demands of automotive, medical, aerospace, and high-reliability electronics production—with advanced tools for real-time insight, smarter automation, and superior thermal process control.

To learn more, visit www.kicthermal.com.

09/26/2025

Koh Young to Make First Appearance at iMAPS: See Koh Young at iMAPS, Booth 805

SEOUL, KOREA — Koh Young Technology, the global leader in True 3D measurement-based metrology and inspection solutions, will make its first appearance at iMAPS 2025, the premier event for microelectronics and advanced packaging, taking place September 29 through October 2, 2025 in San Diego. The participation underscores Koh Young’s growing commitment to the advanced packaging and semiconductor industry. At booth 805, Koh Young experts will be available to discuss the proven Meister Series and the ZenStar platform, both designed to address the evolving challenges of next-generation semiconductor packaging.

The Meister Series has established itself as a benchmark for high-resolution inspection of System-in-Package (SiP), Advanced Package, and 3D semiconductor devices. Delivering high resolution, precision optics, and AI-driven analysis, the Meister Series provides accurate measurement of critical dimensions, bumps, pillars, and other essential structures. Its versatility makes it equally valuable in R&D environments and high-volume production lines where yield and reliability are critical.

Addressing wafer-level metrology, the ZenStar builds on Koh Young’s True 3D measurement foundation to deliver the speed, accuracy, and scalability required for the applications. As advanced device architectures push the limits of conventional metrology, The ZenStar provides semiconductor and packaging engineers with the performance and confidence needed to maintain process stability and accelerate time-to-market.

“Our first appearance at iMAPS reflects Koh Young’s focus on advanced packaging and semiconductors,” said Allen Phung, Head of Sales for the Americas at Koh Young America. “By combining the proven performance of the Meister with the scalability of the ZenStar, we’re helping manufacturers achieve higher yield, greater reliability, and faster time-to-market for next-generation devices.”

Koh Young will be available in booth 805 throughout the event to share insights, discuss application challenges, and highlight how its solutions are shaping the future of semiconductor packaging. Attendees can also learn more by visiting www.kohyoungamerica.com.

August 2025

09/24/2025

Scienscope Recognized with Industry Award: CHINO, CA — Scienscope International is proud to announce that its IMS-100 has received a 2025 Mexico Technology Award in the category of Component Management. The award was presented during a ceremony held at SMTA Guadalajara 2025, Mexico’s premier electronics manufacturing event.

IMS-100: Simplifying Inventory and Reel Management

The award-winning IMS-100 is a compact, intelligent component storage and retrieval solution designed to improve efficiency, accuracy, and visibility in SMT production environments. Developed to meet the growing need for automated material handling, the IMS-100 streamlines reel storage, component traceability, and inventory control within a small footprint—making it ideal for manufacturers in space-conscious facilities.

With high-speed automatic loading and retrieval of reels, full barcode traceability, and seamless MES/ERP integration, the IMS-100 dramatically reduces material handling time, human error, and production delays caused by mismanaged inventory. Its intelligent design includes:

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A modular storage structure that holds up to 720 reels (7") in a compact footprint

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Fast reel retrieval in under 10 seconds per reel

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Real-time inventory tracking with full component traceability

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Integration with pick-and-place machines, MES systems, and Scienscope’s broader suite of component management tools

“We are excited to be recognized with a 2025 Mexico Technology Award for the IMS-100,” said Danny Lumbreras, National Sales Manager, Scienscope International. “This solution represents our continued effort to help manufacturers solve real-world challenges in inventory accuracy, traceability, and lean material flow.”

The IMS-100 complements Scienscope’s full ecosystem of component management technologies, including X-ray reel counters, label scanning systems, and integrated storage solutions, all designed to create a smarter, more connected production floor.

The Mexico Technology Awards, organized by Mexico EMS, recognize the most innovative and impactful solutions introduced into the Mexican electronics manufacturing market over the past year. The awards spotlight cutting-edge achievements by OEM equipment and materials suppliers that are helping to advance the region’s manufacturing capabilities. Learn more at: www.mexicoems.com/mta-awards.

For further information, please email Scienscope at [email protected], call 1-909-590-7273, or visit www.scienscope.com.

August 2025

09/24/2025

TTCI Wins Technology Award for Test Services: BALTIMORE, MD — The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is honored to receive the 2025 Mexico Technology Award in the Test Services category. The award was presented during a ceremony held at SMTA Guadalajara 2025, recognizing TTCI’s decades of expertise in Design for Testability (DFT), which has helped shape best practices in test engineering.

As a veteran-owned and ITAR-registered test development and board testing facility, TTCI brings more than 100 years of combined engineering experience to customers throughout every phase of the product lifecycle. From early design consultation to production testing, TTCI’s approach to testability improves product dependability, increases manufacturing yield, and shortens time to market, making it a trusted partner in critical industries such as aerospace, defense, medical, and industrial electronics.

“I am very happy to be part of this new adventure with TTCI. This is one of the most exciting things to happen for us as a rep company in the SMT industry. Their capabilities are amazing and such a perfect complement to the products and equipment we already offer. I’m so glad to be working with the TTCI group and thankful for all the support from Bert and his team.” — Eduardo Ortiz, USM Reps

Testability is integrated into products from the earliest stages rather than added as an afterthought. TTCI works closely with design teams before layout to help plan component placement and test access, and also reviews completed designs to identify any gaps in test coverage. They create annotated schematics that point out areas lacking physical access and recommend modifications to improve electrical testability. Their test specifications clearly define what tests will be performed, how they will be conducted—whether in-circuit, flying probe, boundary scan, or functional test—and how often, ensuring everyone from engineering to manufacturing is aligned.

In addition, TTCI optimizes boundary scan implementations, blending them with other test methods to increase coverage where physical access is limited. By using native CAD data, they build test programs compatible with major platforms like Keysight, Teradyne, and Seica, helping to reduce debugging time and speed deployment. A unique feature of TTCI’s service is the use of the PPVS metric—Presence, Polarity, Value, and Solder—to predict test and inspection coverage across different methods, giving customers a clear understanding of what is covered and where improvements can be made.

TTCI has earned a reputation for accuracy and reliability with their flying probe, in-circuit, boundary scan, and functional test services. Customers consistently report achieving test coverage of up to 95 percent on complex boards, experience faster debugging and yield improvements with as much as a 40 percent drop in rework, and find better collaboration between design and test teams thanks to TTCI’s detailed deliverables and expertise.

The Mexico Technology Awards recognize the most recent technological innovations in Mexico's manufacturing landscape, spotlighting achievements by OEM manufacturing equipment and materials suppliers over the past year. For more information about the awards, please visit: www.mexicoems.com/mta-awards.

TTCI continues to lead the way in test engineering. Their deep experience and thorough approach help electronics manufacturers design, produce, and deliver products with confidence and consistency.

To schedule a meeting with TTCI or to learn more about its test services, visit www.ttci.com.

August 2025

09/24/2025

LPKF Launches CuttingMaster 2246: See LPKF at Productronica, Booth B2.305

TUALATIN, OR — LPKF Laser & Electronics SE, a global leader in precision laser manufacturing solutions, today announced the launch of the CuttingMaster 2246, the next-generation laser depaneling system that represents a significant leap forward in PCB processing technology. The system will make its official debut at this year's Productronica Show in Munich, where visitors can experience firsthand the revolutionary capabilities that set new industry standards.

Building on the proven success of the CuttingMaster 2240, the new system delivers improved performance while maintaining LPKF's signature precision and reliability.

The Next Big Step Forward in Laser Depaneling

The CuttingMaster 2246 incorporates groundbreaking Integrated Tensor Technology, enabling unprecedented performance improvements across all quality levels. This innovative approach ensures stress-free, high-precision cutting while significantly reducing processing times, making it the ideal solution for high-volume electronics manufacturing environments demanding both speed and quality.

"The CuttingMaster 2246 represents our commitment to continuous innovation and customer success," said Patrick Stockbrügger, Product Manager at LPKF. "By achieving a 20% performance boost while integrating advanced features like Tensor Technology, we're not just improving a product – we're redefining what's possible in laser depaneling technology."

Delivering Unmatched Performance and Value

The CuttingMaster 2246 achieves approximately 20% improved performance over its predecessor while delivering the industry's best price-performance ratio. This enhanced performance extends across all quality levels, ensuring that manufacturers can achieve superior results regardless of their specific application requirements. The integration of advanced Tensor Technology represents a fundamental breakthrough in laser depaneling precision, enabling more consistent and reliable cutting operations.

Beyond core performance improvements, the system offers optional features that provide manufacturers with enhanced control and flexibility. The optional Automatic Power Measurement ensures consistent quality control throughout production runs, while the optional width adjustment feature delivers enhanced operational flexibility to accommodate varying PCB specifications without manual intervention.

The CuttingMaster 2246 is designed from the ground up for Industry 4.0 manufacturing environments. The system seamlessly integrates into existing production lines through comprehensive interface support including SMEMA, HERMES, and OPC UA protocols. This ensures full compatibility with modern manufacturing ecosystems without disrupting established workflows or requiring extensive system modifications.

Perhaps most importantly, the CuttingMaster 2246 offers flexible automation levels that can be adapted to meet specific customer requirements. Whether manufacturers need basic manual operations for prototype work or fully automated systems for high-volume production lines, the system's adaptable architecture ensures optimal performance tailored to each unique manufacturing environment.

"Our customers operate in diverse manufacturing environments with varying automation needs," added Patrick Stockbrügger. "The CuttingMaster 2246's flexible architecture ensures that whether you're running prototype quantities or high-volume production, you get optimal performance tailored to your specific requirements."
See It First at Productronica Munich

Industry professionals will have the first opportunity to see the CuttingMaster 2246 in action at this year's Productronica Show in Munich, where LPKF will demonstrate the system's revolutionary capabilities and advanced features. Following the trade show debut, the system will be available through LPKF's global sales network, backed by the company's comprehensive customer support program including expert consultation, comprehensive training programs, ongoing maintenance support, and global service coverage spanning more than 60 countries worldwide.

LPKF Laser and Electronics
12555 SW Leveton Drive
Tualatin, OR 97062
www.lpkf.com

August 2025

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