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11/24/2025

Koh Young to Demo True 3D Inspection: See Koh Young at SEMICON Japan, Booth E5528


SEOUL, KOREA — Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, will showcase its latest semiconductor inspection portfolio at SEMICON Japan 2025, held from December 17 to 19 at Tokyo Big Sight in Booth E5528. This year’s exhibit highlights Koh Young’s commitment to delivering production-speed and high-precision inspection solutions for advanced packaging applications, including high-density substrates and mirror-like die surfaces.

Koh Young will feature two systems that expand True 3D inspection into critical semiconductor processes. The Meister D+ system will be operating in the booth for live demonstrations, and a ZenStar model will be onsite to facilitate discussion with our process experts:

* Meister D+ Breakthrough in True 3D Measurement for Highly Reflective Components. The Meister D+ provides a comprehensive inspection solution utilizing advanced 3D optical technology and AI-driven analysis to detect all possible defects in semiconductor back-end and advanced packaging processes. It reliably identifies and analyzes micro-cracks, chipping, foreign materials, and other critical defects that may occur in SiP manufacturing.

* ZenStar True 3D Inspection Solutions for Advanced and Wafer-level Packaging. The ZenStar offers a robust inspection solution capable of fully detecting all potential defects in wafer-level packaging (WLP) processes. By integrating laser optical technology with a 2D/3D multi-modal approach, it ensures stable and highly accurate detection and analysis of defects such as micro-cracks, chipping, foreign materials, solder bumps, micro-bumps, and other critical packaging defects in increasingly miniaturized applications.

“SEMICON Japan brings together the leaders driving the future of advanced packaging,” said Tom Hattori, President of Koh Young Japan. “Our Meister D+ and ZenStar solutions reflect our commitment to deliver True 3D measurement and reliable defect detection at production speeds, helping customers stabilize processes and improve yield.”

Today, Koh Young continues to address increasingly complex applications such as surface mount, machined components, press-fit and through-hole pins, conformal coating, dispensing, and semiconductor packaging. The company’s ongoing innovation and customer-driven R&D remain the driving forces behind its market leadership. Koh Young uses its global network of offices and regional teams to deliver local support, training, and process expertise, helping manufacturers turn inspection data into decisive, closed-loop actions on the path to a smart factory.

Koh Young invites visitors to Booth E5528 to see live demonstrations and discuss specific advanced packaging challenges with our team of expert engineers.

Learn more about True 3D measurement-based inspection and metrology solutions at www.kohyoung.com.

October 2025

11/24/2025

Inovaxe's InoBright Smart Storage Wins Award: BOCA RATON, FL — Inovaxe, a world leader and provider of innovative material handling and inventory control systems, is proud to announce that its InoBright Smart Storage Management System has won the 2025 Global Technology Award in the Component Storage – Smart Rack Systems category. The award was presented during a ceremony at productronica in Munich on Tuesday, November 18, 2025.

The InoBright Smart Storage Management System transforms traditional pick-and-place feeder carts into connected, intelligent storage assets. By giving operators real-time visibility into component locations, orientation, and setup status, the system helps eliminate errors, speed up changeovers, and keep SMT lines running efficiently.

“InoBright was designed to make one of the most error-prone steps in SMT production simple and reliable,” said Margy Khoshnood, Executive VP at Inovaxe. “Winning this award is a strong signal that our approach is making a real difference for manufacturers, helping them save time, reduce mistakes, and run smoother operations.”

The system integrates easily with existing SMT workflows and a wide variety of feeder systems, giving manufacturers flexible control over material handling. With smart data tracking and intuitive operation, InoBright allows teams to identify issues before they impact production and respond quickly, improving both efficiency and traceability.

With its combination of speed, accuracy, and connected intelligence, InoBright is helping electronics manufacturers optimize their lines while supporting modern, Industry 4.0-ready operations.

Since 2005, the prestigious Global Technology Awards have recognized the absolute best new innovations in the printed circuit assembly and packaging industries. It brings together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net.

To learn more, visit www.inovaxe.com.

October 2025

11/24/2025

SMTA: 2025 Charles Hutchins Educational Grant Winner Announced: MINNEAPOLIS, MN — SMTA is honored to announce Abdelrahman Farrag, a Ph.D. candidate from State University of New York at Binghamton, has been selected as the winner of the 2025 Charles Hutchins Educational Grant.

The SMTA Grant Committee selected Abdelrahman’s project entitled "Advancing Physics-Informed Machine Learning in Surface Mount Technology." He is currently pursuing a Ph.D. in Electronic Engineering.

The Charles Hutchins Educational Grant was established in memory of past SMTA president, educator, mentor, and industry colleague, Dr. Charles Hutchins. The $8000 grant has been presented annually since 1998 to a full-time, graduate-level student pursuing a degree and working on thesis research in electronics assembly, electronics packaging, or a related field.

The award was presented at the 2025 SMTA International Conference, October 19-23, 2025 in Rosemont, IL, USA.

The SMTA will begin accepting applications for the 2026 Charles Hutchins Educational Grant in early 2026. View details at the website: https://smta.org/page/hutchins-grant.

Please contact Dan Atwood, [email protected] or +1-952-920-7682, with questions.

October 2025

11/24/2025

Arch Systems’ AI Dashboard Vision Wins Award: PALO ALTO, CA — Arch Systems, a leader in manufacturing data and AI solutions, is proud to announce that its AI Dashboard Vision capability has been named the winner of the 2025 Global Technology Award in the Software – Process Control category. The award was presented during a ceremony at productronica in Munich, Germany, on Tuesday, November 18, 2025.

Powered by Arch’s Agentic AI, AI Dashboard Vision can interpret live data directly from machine dashboards and management system screens, providing real-time expert guidance across operations. By removing the need for complex integrations or centralized data lakes, the solution helps manufacturers extract immediate value from the systems they already use—shortening response times and expanding the reach of AI-driven insights across the factory floor.

“Manufacturers want AI that delivers results now—not after months of setup,” said Andrew Scheuermann, CEO and Co-Founder of Arch Systems. “AI Dashboard Vision delivers expert-level guidance in real time, straight from the dashboards already on the factory floor.”

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Key Benefits of AI Dashboard Vision:

Broader AI Insight, Minimal Effort: Reads from a wide range of existing sources—new and legacy equipment, manufacturing systems, or reports—without the need for costly integration projects.

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Maximize Current Investments: Works directly with dashboards and tools already deployed in the factory, unlocking new intelligence without additional IT overhead.

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Faster Results: Deploys in a matter of weeks, enabling teams to act on guided recommendations almost immediately.

Target Critical Operations: Delivers advanced process control capabilities on any machine or system with a screen, allowing manufacturers to focus on their highest-impact challenges.

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Agentic Workflow Ex*****on: Extends AI-driven actions through connected systems such as MES, CMMS, or QMS—automating corrective processes from detection to resolution.

Now active in manufacturing sites globally, AI Dashboard Vision is helping leading electronics and discrete manufacturers resolve issues faster, improve first-pass yield, and cut operational costs—without major system overhauls.

Established in 2005, the Global Technology Awards honor exceptional new products and solutions in printed circuit assembly and packaging. The program highlights organizations driving innovation and excellence across the global manufacturing community. More information is available at www.globalsmt.net.

By leveraging AI to unlock insights from existing factory systems, Arch enables manufacturers to scale expertise, improve critical KPIs, and drive measurable impact on the shop floor. Learn more at archsys.io.

October 2025

11/24/2025

TopLine Offers Waffle Pack Chip Trays: MILLEDGEVILLE, GA — TopLine Corporation now offers 2-inch and 4-inch waffle pack chip trays, available for all die sizes, shipping from stock and with quick delivery guaranteed.

“These waffle pack chip trays are easy to purchase online from our catalog, and we welcome small orders,” says Martin Hart, TopLine CEO. “Additionally, covers and clips are available. We also offer JEDEC Matrix IC trays,” he adds.


To find out more, visit www.TopLine.tv/tray.html, Tel 1-800-776-9888, email: [email protected].

October 2025

11/24/2025

Peter Chen Joins Technica as Director of Service: SAN JOSE, CA — Technica USA is proud to announce that Peter Chen has joined the company as Director of Service. Jason Perry, President of Technica USA, stated, “As part of our ongoing growth and commitment to operational and service excellence, I’m very pleased to welcome Peter to our team. Peter has more than 25 years of experience managing technical support and field service team in the hardware and software industry. He brings an impressive track record of success in leading and scaling technical support, field service, and customer success functions at global technology organizations.”

Prior to joining Technica, Peter held senior leadership roles at Siemens, Schneider Electric, SEB Professional, Work Wave where he built and managed large-scale service organizations, implemented performance KPIs, and developed strategies that enhanced customer experience and operational efficiency and introduced innovative support processes and technologies, and mentored teams to achieve and exceed service performance goals.

Perry added, “The Director of Service is a new role at Technica and underscores our commitment to transforming our service operations into a world-class organization that delivers even greater value to our customers and supply partners. Peter will lead the creation and implementation of Technica’s service structure and strategy across our product lines, working closely with our talented service team to enhance customer satisfaction, improve responsiveness, and strengthen our long-term support model.”

As a subsidiary of EMC-Taiwan, Technica USA continues to expand its footprint, product portfolio, and market presence, positioning itself for continued growth and success in both existing and emerging markets. www.technica.com.

October 2025

11/21/2025

Kurtz Ersa Receives Two Global Technology Awards: PLYMOUTH, WI — Kurtz Ersa Inc., a leading supplier of electronics production equipment, has been honored with two 2025 Global Technology Awards, recognizing innovation in both rework and soldering technologies. The awards were presented at productronica in Munich on Tuesday, November 18, 2025.

The company received the award in the Rework & Repair Tools category for its HR 600P High-End Rework System and in the Soldering – Other category for the POWERFLOW FIVE Wave Soldering System.

The HR 600P sets a new benchmark in rework with its automated residual solder removal module, the SC 600 Scavenger, which clears solder without any mechanical contact. This process protects sensitive PCB substrates while boosting efficiency and reliability. Its hybrid heating head, combining infrared and convection, ensures precise thermal control, while closed-loop regulation and high-precision axis movement deliver consistent results. Supporting components from 1 x 1 mm up to 60 x 60 mm, the system is suited for everything from miniature parts to large BGAs.

The POWERFLOW FIVE redefines wave soldering performance with features such as dynamic z-axes, wave height control, and section-based soldering, enabling accuracy and reproducibility even with complex designs. Built to handle PCBs up to 25 kg, the system reduces scrap rates and maintains high throughput. Energy-efficient heating modules and the SMART ELEMENTS® filter system minimize operating costs and environmental impact, while intuitive software and accessible design make it straightforward to operate and maintain.

“We’re excited to see both the HR 600P and POWERFLOW FIVE recognized this year,” said Todd DeZwarte, Director of Sales, Kurtz Ersa, Inc. “Each system reflects the direction of electronics manufacturing—more precise, more efficient, and easier to use.”

Since 2005, the prestigious Global Technology Awards have recognized the absolute best new innovations in the printed circuit assembly and packaging industries. It brings together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net.

For more information on the HR 600P Rework System, visit www.kurtzersa.com.

October 2025

11/21/2025

Essemtec's Tarantula Dual Lane Earns 2025 GTA: AESCH, SWITZERLAND — Essemtec, a global leader in adaptive, highly flexible surface mount technology (SMT) solutions, is proud to announce that its Tarantula Dual Lane dispensing & Jetting platform has won a 2025 Global Technology Award in the Dispensing Equipment category. The award was presented during a ceremony at productronica 2025 in Munich, Germany, on Tuesday, November 18, recognizing Essemtec’s advanced dispensing & Jetting technologies for high-volume, high-mix production environments.

The Tarantula Dual Lane is Essemtec’s most advanced dispensing platform to date, designed to combine speed, precision, and versatility in a single compact footprint. With its dual-lane architecture, the system enables independent processing on two lanes simultaneously, delivering significant productivity gains without increasing floor space.

“Winning this award at productronica is a true honor,” said Pierre-Jean Cancalon, Head of Marketing & Communications at Essemtec. “The Tarantula Dual Lane was engineered to give manufacturers the highest level of flexibility for high speed line, while maintaining the exceptional quality and versatility Essemtec is known for.”

The platform features next-generation control technology for faster, more precise jetting and dispensing, supporting real-world performance of 350,000 dots per hour in average with Jet-on-the-Fly solder paste jetting and a maximum frequency of 1’100’000 dots per hour. Its ability to integrate up to three dispensing valves in one system allows manufacturers to combine multiple processes—such as solder paste jetting, glue or epoxy jetting, and contact dispensing—without additional equipment.

Beyond performance, the Tarantula Dual Lane is designed to maximize production quality with optional 2D solder paste inspection (SPI) and auto-correction, integrated traceability, and a holistic approach to process control. These features help improve first-pass yield, reduce rework, and enhance overall process stability.

Manufacturers also benefit from reduced costs and lower environmental impact. The Tarantula Dual Lane minimizes material waste by jetting the exact amount required, eliminates the need for stencil cleaning chemicals, and reduces overall line complexity by replacing multiple machines with one. The Tarantula Dual Lane could also work in complement of a traditional screen by eliminating stepped stencil designs, applying solder exactly where needed in cavities for example or for ultra-fine pitch and special components.

Ease of use remains a hallmark of Essemtec platforms. The Tarantula Dual Lane leverages Essemtec’s intuitive ePlace software, optimized job preparation tools, and compatibility with EasyLogix PCB-Investigator, making setup faster and more efficient. Its modular design, software upgrade options, and remote diagnostics ensure a long lifecycle and protect manufacturers’ investment. The IPC Hermes and CFX are also supported to ensure a seamless integration into any factory environment.

With its winning combination of scalability, precision, and sustainability, the Tarantula Dual Lane sets a new standard for dispensing and Jetting equipment in high-volume electronics manufacturing.

3 Valves. 2 Lanes. 1 Smarter Solution.

Tarantula Dual Lane – Endless Versatility in Dispensing & Jetting

Since 2005, the prestigious Global Technology Awards have recognized the absolute best new innovations in the printed circuit assembly and packaging industries. It brings together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net.

For more information about Essemtec and its full line of adaptive SMT solutions, visit www.essemtec.com.

October 2025

11/21/2025

Essemtec Receives an Award for Tarantula Dual Lane: AESCH, SWITZERLAND — Essemtec, a global leader in adaptive, highly flexible surface mount technology (SMT) solutions, is proud to announce that its Tarantula Dual Lane dispensing & Jetting platform has won a 2025 Global Technology Award in the Dispensing Equipment category. The award was presented during a ceremony at productronica 2025 in Munich, Germany, on Tuesday, November 18, recognizing Essemtec’s advanced dispensing & Jetting technologies for high-volume, high-mix production environments.

The Tarantula Dual Lane is Essemtec’s most advanced dispensing platform to date, designed to combine speed, precision, and versatility in a single compact footprint. With its dual-lane architecture, the system enables independent processing on two lanes simultaneously, delivering significant productivity gains without increasing floor space.

“Winning this award at productronica is a true honor,” said Pierre-Jean Cancalon, Head of Marketing & Communications at Essemtec. “The Tarantula Dual Lane was engineered to give manufacturers the highest level of flexibility for high speed line, while maintaining the exceptional quality and versatility Essemtec is known for.”

The platform features next-generation control technology for faster, more precise jetting and dispensing, supporting real-world performance of 350,000 dots per hour in average with Jet-on-the-Fly solder paste jetting and a maximum frequency of 1’100’000 dots per hour. Its ability to integrate up to three dispensing valves in one system allows manufacturers to combine multiple processes—such as solder paste jetting, glue or epoxy jetting, and contact dispensing—without additional equipment.

Beyond performance, the Tarantula Dual Lane is designed to maximize production quality with optional 2D solder paste inspection (SPI) and auto-correction, integrated traceability, and a holistic approach to process control. These features help improve first-pass yield, reduce rework, and enhance overall process stability.

Manufacturers also benefit from reduced costs and lower environmental impact. The Tarantula Dual Lane minimizes material waste by jetting the exact amount required, eliminates the need for stencil cleaning chemicals, and reduces overall line complexity by replacing multiple machines with one. The Tarantula Dual Lane could also work in complement of a traditional screen by eliminating stepped stencil designs, applying solder exactly where needed in cavities for example or for ultra-fine pitch and special components.

Ease of use remains a hallmark of Essemtec platforms. The Tarantula Dual Lane leverages Essemtec’s intuitive ePlace software, optimized job preparation tools, and compatibility with EasyLogix PCB-Investigator, making setup faster and more efficient. Its modular design, software upgrade options, and remote diagnostics ensure a long lifecycle and protect manufacturers’ investment. The IPC Hermes and CFX are also supported to ensure a seamless integration into any factory environment.

With its winning combination of scalability, precision, and sustainability, the Tarantula Dual Lane sets a new standard for dispensing and Jetting equipment in high-volume electronics manufacturing.

3 Valves. 2 Lanes. 1 Smarter Solution.

Tarantula Dual Lane – Endless Versatility in Dispensing & Jetting

Since 2005, the prestigious Global Technology Awards have recognized the absolute best new innovations in the printed circuit assembly and packaging industries. It brings together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net.

For more information about Essemtec and its full line of adaptive SMT solutions, visit www.essemtec.com.

October 2025

11/21/2025

Keystone Electronics Offers SEMS PCB Screw: NEW HYDE PARK, NY — A SEMS screw option is available on Keystone Electronics popular PCB screw terminals offering additional ease in securing and stabilizing wire lead attachments, including bare wires in PCB applications.

Rated at 15 and 30 Amps, this innovative screw terminal design features exclusive anti-rotation, non-rocking design making them ideal for high density packaging. In addition, the SEMS screw incorporates a captivated, free-spinning lock-washer to eliminate wire twisting upon tightening terminals.

Combined with space-saving, cost effective attributes, the units enable design versatility for universal applications. SEMS screw units are available in horizontal and vertical mounting configurations. Terminals are manufactured from Brass with Tin-Plate and are supplied with SEMS installed and captivated on the terminals or unassembled. Available from our global distribution network and online.

Keystone Electronics designs and manufactures more than 5,000 interconnect components and hardware in addition to providing stamping, machining and assembly services to meet customer required modifications and special designs. An in-house application engineering group is on hand to facilitate your needs.

ISO-9001:2015 certified and RoHS compliant, Keystone has headquarters in the US with offices in Canada, Europe, Australia and Asia. For more information, contact Keystone Electronics Corp., 55 South Denton Avenue, New Hyde Park, NY 11040. Tel: (800) 221-5510; fax: (516) 328-1080; E-mail: [email protected] or visit www.keyelco.com. Ask for our new Catalog K75.

October 2025

11/21/2025

KIC's HeatMap Wins 2025 Global Technology Award: SAN DIEGO, CA — KIC, the leader in smart thermal process technologies for electronics manufacturing, has won the 2025 Global Technology Award in the Thermal Profilers category for its KIC HeatMap™ solution. The award was presented during a ceremony at productronica in Munich, Germany on Tuesday, November 18, 2025.


HeatMap™ redefines what a thermal profiler can do, transforming KIC’s SPS Smart Profiler and X5 Profiler platforms from intermittent setup tools into continuous production monitoring systems. Traditionally, profilers are used only during new product introduction (NPI) or periodic process checks. With HeatMap™ manufacturers gain real-time monitoring of oven zone temperatures throughout production runs—closing the gap between initial setup and production.

The system combines an embedded multi-zone thermocouple probe, optional alarm light bar, and enhanced Thermal Analysis Software (TAS) to provide a live graphical display of each oven zone’s performance against a reference profile. Operators and engineers can instantly detect thermal deviations that could impact solder quality, trigger rework, or cause costly downtime.

Key capabilities include:

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Live zone temperature monitoring

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Automatic tolerance definition

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Increased profiler utilization

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Fast detection of intermittent drifts

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Machine traceability

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Optional light bar alerts

By leveraging your existing profiler investment, HeatMap™ offers a rapid cost-effective upgrade to continuous monitoring, without requiring new ovens or workflow changes. It can be deployed in hours, with either self-installation or KIC’s support.

“KIC HeatMap™ bridges a critical gap in thermal process control,” said Miles Moreau, General Manager at KIC. “It lets manufacturers see exactly how their ovens are performing in real-time, so they can act before problems turn into defects or downtime.”

Since 2005, the prestigious Global Technology Awards have recognized the absolute best new innovations in the printed circuit assembly and packaging industries. It brings together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net.

To learn more, visit kicthermal.com.

October 2025

11/21/2025

Kurtz Ersa Wins Two Global Technology Awards: PLYMOUTH, WI — Kurtz Ersa Inc., a leading supplier of electronics production equipment, has been honored with two 2025 Global Technology Awards, recognizing innovation in both rework and soldering technologies. The awards were presented at productronica in Munich on Tuesday, November 18, 2025.

The company received the award in the Rework & Repair Tools category for its HR 600P High-End Rework System and in the Soldering – Other category for the POWERFLOW FIVE Wave Soldering System.

The HR 600P sets a new benchmark in rework with its automated residual solder removal module, the SC 600 Scavenger, which clears solder without any mechanical contact. This process protects sensitive PCB substrates while boosting efficiency and reliability. Its hybrid heating head, combining infrared and convection, ensures precise thermal control, while closed-loop regulation and high-precision axis movement deliver consistent results. Supporting components from 1 x 1 mm up to 60 x 60 mm, the system is suited for everything from miniature parts to large BGAs.

The POWERFLOW FIVE redefines wave soldering performance with features such as dynamic z-axes, wave height control, and section-based soldering, enabling accuracy and reproducibility even with complex designs. Built to handle PCBs up to 25 kg, the system reduces scrap rates and maintains high throughput. Energy-efficient heating modules and the SMART ELEMENTS® filter system minimize operating costs and environmental impact, while intuitive software and accessible design make it straightforward to operate and maintain.

“We’re excited to see both the HR 600P and POWERFLOW FIVE recognized this year,” said Todd DeZwarte, Director of Sales, Kurtz Ersa, Inc. “Each system reflects the direction of electronics manufacturing—more precise, more efficient, and easier to use.”

Since 2005, the prestigious Global Technology Awards have recognized the absolute best new innovations in the printed circuit assembly and packaging industries. It brings together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net.

For more information on the HR 600P Rework System, visit www.kurtzersa.com.

October 2025

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