IEEE Journal on Flexible Electronics - J-FLEX

IEEE Journal on Flexible Electronics - J-FLEX The IEEE Journal on Flexible Electronics publishes cutting edge research on flexible substrates.

The latest issue of J-FLEX (Volume 4, Issue 2) was just released! With great pleasure, I introduce the invited review pa...
05/01/2025

The latest issue of J-FLEX (Volume 4, Issue 2) was just released!

With great pleasure, I introduce the invited review paper, “Flexible Sensors for IoT-Based Health Monitoring.”

The cover artwork is emblematic of this IoT health monitoring system:

"Flexible sensors conform naturally to the body for comfortable, long-term wear—seamlessly tracking vital signs throughout daily life. Integrated with the Internet of Things (IoT), they provide continuous, real-time health data to users and healthcare providers. This fusion of ergonomic design and smart connectivity empowers remote monitoring, timely alerts, and personalized, proactive care tailored to individual needs."

J-FLEX is a joint publication of IEEE Sensors Council (SC), IEEE Electron Devices Society, and IEEE Circuits and Systems Society (CASS):

https://ieee-jflex.org/

Scientific publications are always a moving target, new innovations and new challenges.Always an informative meeting for...
04/26/2025

Scientific publications are always a moving target, new innovations and new challenges.

Always an informative meeting for the annual IEEE Panel of Editors, representing IEEE Journal on Flexible Electronics (J-FLEX), as the current and founding Editor-in-Chief (Paul Berger).

Wonderful interactions with friends and colleagues.

The latest issue of J-FLEX (Volume 4, Issue 1) was just released! With great pleasure, I introduce the publication in IE...
04/25/2025

The latest issue of J-FLEX (Volume 4, Issue 1) was just released!

With great pleasure, I introduce the publication in IEEE Journal on Flexible Electronics (J-FLEX) of the extended papers from the 2024 IEEE International Conference on Flexible, Printable Sensors and Systems (IEEE FLEPS), held in Tampere, Finland.

I wish to thank our authors, reviewers and especially our guest editors, who are Matti Mäntysalo, Gaetano Marrocco, Shweta Saxena Agarwala, Gerd Grau, and Wei Gao.

J-FLEX is a joint publication of IEEE Sensors Council (SC), IEEE Electron Devices Society, and IEEE Circuits and Systems Society (CASS):

https://ieee-jflex.org/

The latest issue of J-FLEX (Volume 3, Issue 12) was just released! This covers a Cross Society Special Issue (IFETC & IS...
03/29/2025

The latest issue of J-FLEX (Volume 3, Issue 12) was just released!

This covers a Cross Society Special Issue (IFETC & ISCAS) on Flexible Hybrid Electronics: Advancing Next-Generation Applications. This Special Issue showcases pioneering research in flexible circuit designs, with a focus on thin-film transistors and printed materials tailored for thermal and microwave applications. The following articles exemplify the innovative strides being made in this field.

In Zhang et al. introduce a bidirectional biomedical pixel interface circuit based on low-temperature polycrystalline silicon thin-film transistors (LTPS-TFTs), designed specifically for large-area medical applications. Key performance metrics include a 40-dB gain, an input noise of 86.2 µV/√Hz, and an effective number of bits (ENOB) of 9.13, with stability confirmed via statistical tests on 20 chips.

In Ranjan et al. delve into the design of low-power digital circuits using hydrogenated amorphous silicon thin-film transistors (a-Si:H TFTs), with an emphasis on unipolar TFT logic gates on flexible substrates. A 3-to-8 decoder—implemented on both glass and flexible substrates—demonstrates an average total power reduction of 46.5% across various operating conditions.

In Ersan et al. explore the fabrication of X-band (8–12 GHz) frequency selective surfaces (FSSs) on glass fiber fabrics using an optimized screen-printing process. The work focuses on how the size and morphology of conductive particles influence electromagnetic performance, offering critical insights into the design of high-performance FSS structures.

In Govind et al. investigate the development of graphene-based phase-change thermal interface nanocomposites and heat sinks to advance thermal management in integrated circuits (ICs). By integrating graphene into paraffin, the resulting nanocomposites exhibit markedly enhanced thermal conductivity.

About the Cover: This is a conceptual bandage-like wearable FHE sensing system, using advanced printing and thin silicon techniques. It will have printed sensors/sensor peripherals, as simple as temperature/EEG/ECG/EMG, glucose, lactate, biomarkers integrated with multiplexing circuitry and amplifier to perform readout and amplification. Also, printed super cap for power supply and printed antenna for RF communication. Ultra-thin and light FHE can achieve wear and forget; and provide continuous monitoring; and the whole system as indicated can be partially disposable and partially reusable.

https://ieee-jflex.org/

J-FLEX is a joint publication of IEEE Sensors Council (SC), IEEE Electron Devices Society (EDS), and IEEE Circuits and Systems Society (CASS):

The latest issue of J-FLEX (Volume 3, Issue 11) was just released!In this Special Issue, we celebrate the invention of t...
03/02/2025

The latest issue of J-FLEX (Volume 3, Issue 11) was just released!

In this Special Issue, we celebrate the invention of the transistor, over 75 years ago, in 1947 by physicists John Bardeen, Walter Brattain, and William Shockley at AT&T Bell Labs in Murray Hill, New Jersey in USA [1-3], who all shared in the 1956 Nobel Prize in Physics. This first working transistor, a point-contact transistor, is widely considered to have launched the modern-day electronics age. But even predating Bardeen, Brattain and Shockley, Julius Edgar Lilienfeld, recently immigrated to USA from what is now known as Lviv, Ukraine, to the Boston area of Massachusetts, proposed the concept of a field-effect transistor (FET) through a US patent application in 1926 [4], almost 100 years ago, although he never attempted to build a working prototype.

Today, the thin film transistor (TFT) has evolved from these discoveries to revolutionize the field of display technology, driving the extinction of cathode ray tube (CRT) and plasma displays. For every flat panel display commercially sold in retail stores now, whether a television, a computer monitor, a laptop, a tablet, or a phone, etc., each pixel is driven by a TFT to control greyscale and color. At the core, TFTs are deposited onto a substrate, any substrate, whether crystalline or amorphous, while still producing functional transistors, unlike advanced silicon CMOS for digital computing, high-speed III-V transistors for communications, or high-voltage wide bandgap transistors for the electrification of motors, where those classes of transistors are created by crystalline transistors atop crystalline substrates, often by epitaxy, keeping the deposited layers in registry with the crystalline substrate template. The advent of TFT technology, largely non-crystalline atop glass, has permitted electronics to permeate new vistas, particularly large area applications, like displays.

By unlocking a pathway for efficacious TFTs atop a range of substrates, this also provided a pathway for reduced temperature processing, allowing a range of softer and flexible substrates, like Corning’s Willow® glass and various plastics, to be accessed too. Thus, this Special Issue examines some key evolution within the flexible electronics community on transistors, including TFTs, but also the nascent organic bipolar transistor, which could be poised for great future impact.

So, it gives this Guest Editorial team great pleasure to introduce the following contributions to this very unique Special Issue on flexible electronics transistors during these key anniversary years.

About the Cover: The advent of thin-film transistors (TFT) began in earnest with its evolution from the first field-effect transistor proposed in a patent application in 1926 and the first working transistor, a point contact transistor, developed at AT&T Bell Labs in 1947. The image conveys a timeline from those nascent discoveries and inventions at the beginning of the 20th Century through to the end of the 20th Century, when flat-panel displays displaced bulky displays whereby TFTs were literally the driving force behind red–green–blue (RGB) pixelated displays. In the 21st Century, TFT evolution is now transforming these flat-panel displays into flexible displays and opening vistas for completely new use cases, like medical wearables in the form of electronic tattoos.

The Lilienfeld patent ( #1,745,175, filed on October 8, 1926) image was obtained from sources related to the www.uspto.gov website.
The AT&T Bell Labs point contact transistor image was obtained with permission from the Bell System Memorial website (https://memorial.bellsystem.com/) from their “History of the Transistor” section.

The cover art for this special issue was designed by Mr. Enrique Sahagún from Scixel.

https://ieee-jflex.org/

J-FLEX is a joint publication of IIEEE Sensors Council(SC), IIEEE Electron Devices Society(EDS), and IIEEE Circuits and Systems Society(CASS):

Our J-FLEX Special Issue on Special Issue on the Social Impact of the Internet of Medical Things: From Body Wearables to...
02/05/2025

Our J-FLEX Special Issue on Special Issue on the Social Impact of the Internet of Medical Things: From Body Wearables to Brain Implants is open for submission.

The Guest Editors are: Yuxin Liu (Lead, National University of Singapore); John Rogers (Northwestern University); Benjamin Tee (National University of Singapore); Damien Coyle (IEEE Brain, University of Bath); Ketra Schmitt (TTM EiC, Concordia College); Katina Michael (TTS EiC, Arizona State University); and Paul R. Berger (J-FLEX EiC, Ohio State/Tampere)

In a unique interdisciplinary collaboration with the IEEE’s Society on Social Implications of Technology (SSIT) and IEEE Brain, J-FLEX is joining forces to explore both the technology of the Internet-of-Medical-Things (IoMT) solutions and medical wearables/implantables. Articles on neurotechnologies and their societal implications will be published in J-FLEX, while articles on the broader social implications of neurotechnology, including opinion, commentary, and peer-reviewed articles, will appear in IEEE Technology and Society Magazine (TSM).

The scope of this Special J-FLEX Issue will focus upon system-level applications of IoT and medical wearables but will also welcome technical work that is a key facilitator of these system-level use cases.

Related to the synergy with SSIT, the J-FLEX articles should also address aspects of its carbon neutrality, biodegradability, toxicity, abundance of raw materials, data structures, privacy and surveillance, as well as risks, benefits, efficacy, costs and ease of use. Lastly, an emphasis on application areas where flexible electronics can transcend traditional rigid and bulky CMOS-centric systems.

https://ieee-jflex.org/
https://ieee-jflex.org/wp-content/uploads/2025/02/IEEE_J-FLEX_SI_on_the_Social_Impact_of_Medical_Wearables.pdf

J-FLEX is a joint publication of IEEE Sensors Council (SC), IEEE Electron Devices Society, and IEEE Circuits and Systems Society (CASS):

The latest issue of J-FLEX (Volume 3, Issue 10) was just released!N. Kannan and N. Gupta present an examination of the c...
02/01/2025

The latest issue of J-FLEX (Volume 3, Issue 10) was just released!

N. Kannan and N. Gupta present an examination of the current progress and future prospects in flexible silicon technology, paving the way for further advancements in this rapidly evolving field. This article explores various thinning techniques to fabricate flexible silicon wafers, methods for transferring silicon to flexible substrates, and the importance of enhancing silicon’s stretchability. Furthermore, it discusses the impact of flexible silicon on sectors such as biomedical sensing, electronics, and power systems, highlighting the role of the Internet of Things (IoT) platform in interconnecting devices.

M. Q. Mehmood et al. developed conductive yarn-based textile sensors for wearable multimode human-machine interfaces (HMIs), breathing, and walking pattern detection. The low-cost sewing process is used to develop interdigitated capacitive (IDC) sensor patterns on shirts, masks, and shoe soles using ultrafine highly conductive thread. The developed mask detects the breathing pattern of humans, whether it’s slow, normal, or fast. Shoe Insole developed sensors to see the walking pattern, either slow, normal, or running. Reported textile sensors are washable, flexible, stretchable, comfortable, and reusable, showing the practicality of proposed sensors for personalized healthcare, smart textiles, and electronic textiles (e-textiles).

M. H. P. Puthanveettil et al. show high-hole mobility tellurium nanowires are assembled using nonlinear ac dielectrophoresis to fabricate electrolyte-gated TFTs (EG-TFTs) on a flexible substrate at room temperature. These p-type flexible transistors exhibit an on-off ratio of 3.3×102, an ON-current density of 20 μA μm−1, a specific transconductance of 8.5 μS μm−1, and linear mobility of 20.6 cm2 V−1 s−1 with adequate mechanical strain tolerance.

About the Cover: This work developed conductive yarn-based washable textile sensors for wearable
applications. The low-cost and durable sewing process develops interdigitated capacitive (IDC) sensor patterns on shirts, masks, and shoe soles. Because of their high sensitivity, sensors differentiate different phases of change in physical conditions and respond accordingly. The beneficial features of textiles and biosensors in wearables unleash new opportunities for continuous medical monitoring, health management, and the acquisition of physiological data with the increasing demand for the washability and durability of sensors.

https://ieee-jflex.org/

J-FLEX is a joint publication of IEEE Sensors Council (SC), IEEE Electron Devices Society (EDS), and IEEE Circuits and Systems Society (CASS):

The latest issue of J-FLEX (Volume 3, Issue 9) was just released!S. Nuthalapati et al. present triboelectric nanogenerat...
12/18/2024

The latest issue of J-FLEX (Volume 3, Issue 9) was just released!

S. Nuthalapati et al. present triboelectric nanogenerators (TENGs) for energy harvesters using polydimethylsiloxane (PDMS) and multiwalled carbon nanotubes (MWCNTs)-based TENG. The TENG’s excellent performance was validated by the illumination of 30 blue and 120 red LEDs, as well as other portable electronic devices.

S. Ray and R. Panwar present a review article offers an extensive overview of polymer-constituted microwave-absorbing materials (M**s) and microwave-absorbing structures (MASs), highlighting their significance in modern electromagnetic interference (EMI) mitigation and stealth applications. In summary, this article is useful for researchers in designing and optimizing polymer-based M**s and MASs.

S. Ghosh and L. Rajan present a gate-all-around (GAA) cylindrical nanowire field-effect transistor (NWFET), concentrating on its ammonia (NH3) sensing performance for diagnostic purposes under room temperature (RT). The sensing behavior was enabled through modifications in molybdenum (Mo) and ruthenium (Ru) catalytic metal gate work functions depending on the concentration of NH3 arriving at the metallic surface with threshold voltage sensing responses ( SVTH ) of ~52.3% and ~34.4%, respectively, for Mo and Ru metallic gates under 1.04-ppm NH3 concentration at RT.

S. Palsaniya et al. show paper-based triboelectric generator development (TEG) with multifunctional capabilities. This study includes a detailed analysis of electron transfer mechanisms via energy band models in different environments, highlighting the solid ionic coupling effect on energy states and contact impedance.

About the Cover: The cover artwork represents the innovative landscape of polymer-constituted flexible microwave absorbers, highlighting the integration of unique design principles with cutting-edge technological advancements. The vibrant interplay of colors and intricate structures symbolizes the multifaceted approach to enhancing absorption efficiency, flexibility, and application versatility in microwave absorption and shielding. The cover art for this issue was designed by Mr. Enrique Sahagún from Scixel. See Ray, et al., “Advances in Polymer-Based Microwave Absorbers—From Design Principles to Technological Breakthroughs: A Review”, page 401.

https://ieee-jflex.org/

J-FLEX is a joint publication of IEEE Sensors Council (SC), IEEE Electron Devices Society (EDS), and IEEE Circuits and Systems Society (CASS):

IEEE Journal on Flexible Electronics (J-FLEX) was recently announced as a “High Performer” again, with bibliometric data...
11/28/2024

IEEE Journal on Flexible Electronics (J-FLEX) was recently announced as a “High Performer” again, with bibliometric data showing a 2024 Second Quarter Sub to Pub Report with Average Weeks Submitted to First Decision equal to 4.9 weeks and Average Weeks Submitted to Online Post equal to 9 weeks.

https://ieee-jflex.org/

J-FLEX is a joint publication of IEEE Sensors Council (SC), IEEE Electron Devices Society (EDS), and IEEE Circuits and Systems Society (CASS):

IEEE Journal on Flexible Electronics (J-FLEX) just successfully completed its first IEEE Technical Activities Board's (T...
11/23/2024

IEEE Journal on Flexible Electronics (J-FLEX) just successfully completed its first IEEE Technical Activities Board's (TAB) Periodical Review and Advisory Committee (PRAC) Review, held in Dallas, Texas this morning.

J-FLEX is deemed a very successful journal, off to a great start.

As the Editor-in-Chief of J-FLEX, I want to thank our support staff, Heather Malloy and Mansi Kukurti, our Associate Editor-in-Chief, Luisa Petti, our amazing global Editorial and Guest Editorial teams, and most especially our J-FLEX assigned mentor, Peter Willet, and our financial sponsoring societies/councils, IEEE Sensors Council (SC), IEEE Electron Devices Society (EDS) and IEEE Circuits and Systems Society (CASS).

The latest issue of J-FLEX (Volume 3, Issue 8) was just released!G. Psaltakis et al. created a dataset for pattern recog...
11/16/2024

The latest issue of J-FLEX (Volume 3, Issue 8) was just released!

G. Psaltakis et al. created a dataset for pattern recognition based on thousands of images of experimental current–voltage (I–V) characteristics of solution-processed, and thus printable, mixed halide perovskite memristors.

P. Ashok et al. synthesized VO2 on a flexible Kapton substrate using a low-temperature atmospheric thermal oxidation process. By coupling these flexible VO2 devices to a MOSFET, we demonstrate a steep switching phase-field effect transistor (Phase-FET) with a sub-Boltzmann subthreshold slope (SS) of 29 mV/decade at room temperature

M. Y. Abdelatty et al. studied how meshed ground planes affect the radio frequency (RF) performance of straight microstrip lines, demonstrating that the less-filled meshed ground samples are less susceptible to bending.

M. K. Yadav et al. report on a piezoelectric, flexible polymer sensor based on porous polyvinylideneflouride membrane, able to detect signals generated by finger tapping on various surfaces and when attached to the feet of a walker

About the Cover: Low-temperature atmospheric oxidation enables the synthesis of VO2 on flexible Kapton substrates, exhibiting a structural phase transition and reversible resistance-switching over three orders of magnitude. Integrating flexible VO2 resistors with MOSFETs overcomes the Boltzmann limit for switching, potentially enabling low-power flexible electronics. See “Flexible Vanadium Dioxide Films and Devices on Kapton Fabricated With Low-Temperature Atmospheric Oxidation of Vanadium”, p. 368.

https://ieee-jflex.org/

J-FLEX is a joint publication of IEEE Sensors Council (SC), IEEE Electron Devices Society (EDS), and IEEE Circuits and Systems Society (CASS):

For the first-time, in an effort to promote timeliness for authors contributing to the 2024 2024 IEEE International Flex...
11/01/2024

For the first-time, in an effort to promote timeliness for authors contributing to the 2024 2024 IEEE International Flexible Electronics Technology Conference (IFETC), authors could either: (1) submit their traditional extended 3-page abstract to be considered for an oral/poster IFETC presentation, which is later published as-is in IEEE Xplore, or (2) submit a full 8-page manuscript to this IEEE Journal on Flexible Electronics (J-FLEX) Pre-IFETC “Direct” special issue, which appears much earlier than a traditional post-conference special issue of “extended” papers, expanding from 3-page abstracts to 8-page manuscripts.

This special issue of the IEEE J-FLEX presents ten papers submitted directly to the journal prior to the 2024 IEEE International Flexible Electronics Technology Conference (IFETC) held at the DAMSLab at the University of Bologna, Bologna, Italy, from September 15 to 18, 2024.

Over three days, the IFETC 2024 featured a technical program of 37 invited talks, 57 contributed talks, and 48 poster presentations selected through a rigorous review process and covering a broad array of topics in flexible electronics over the 12 tracks: materials and manufacturing; energy harvesting and storage devices; imaging and lighting devices; sensors, biosensors, and actuators; biointerfaced, bioinspired, and neuromorphic electronics; transistors and circuits; simulation and modeling; reliability and lifetime; heterogeneous and hybrid integration; emerging applications and products; flexible and printable solutions in RFIDs and IoT; and sustainability and energy efficiency, and the four special sessions: biological and bioinspired smart materials; memristor technology: theory, design, and applications; printed biosensors and wearables for healthcare applications; and soft robotics meets soft electronics.

A special thanks to our guest editors, Gregory L. Whiting (lead), Niels Benson, Riccardo Colella, Luisa Petti and Almudena Rivadeneyra.

https://ieee-jflex.org/

J-FLEX is a joint publication of IEEE Sensors Council (SC), IEEE Electron Devices Society (EDS), and IEEE Circuits and Systems Society (CASS):

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